ããBGAè¿ä¿®å° ä¸ï¼éå
å¦æºå(ZM-R380C,ZM-R380B,ZM-R590,ZM-R5830,ZM-R5850,ZM-R5860,ZM-R5850C,ZM-R5860C,) äºï¼å
å¦æºåï¼ZM-R6800ï¼ZM-R6808ï¼ZM-R6810ï¼ZM-R680Cï¼ZM-R680Dï¼ZM-R6821ï¼ZM-R8650ï¼ BGAè¿ä¿®å°
ãã[1] BGAæ¤çå å·¥
ããBGAè¿ä¿®å°
ããåå
å¦å¯¹ä½ä¸éå
å¦å¯¹ä½
ããå
å¦å¯¹ä½ââéè¿å
å¦æ¨¡åéç¨è£æ£±éæåï¼LEDç
§ææ¹å¼ï¼è°æ´å
åºåå¸ï¼ä½¿å°è¯çæåæ¾ç¤ºä¸æ¾ç¤ºå¨ä¸ã以达å°å
å¦å¯¹ä½è¿ä¿®ã éå
å¦å¯¹ä½ ââåæ¯éè¿èç¼å°BGAæ ¹æ®PCBæ¿ä¸å°çº¿åç¹å¯¹ä½ï¼ä»¥è¾¾å°å¯¹ä½è¿ä¿®ã é对ä¸å大å°çBGAå件è¿è¡è§è§å¯¹ä½ï¼çæ¥ãæå¸çæºè½æä½è®¾å¤ï¼æææé«è¿ä¿®çç产çï¼å¤§å¤§éä½ææ¬ã BGAè¿ä¿®å°ZM-R5860C
ããBGAï¼BGAå°è£
å
å BGAå°è£
(Ball Grid Array Package)çI/O端å以åå½¢ææ±ç¶çç¹æéµåå½¢å¼åå¸å¨å°è£
ä¸é¢ï¼BGAææ¯çä¼ç¹æ¯I/Oå¼èæ°è½ç¶å¢å äºï¼ä½å¼èé´è·å¹¶æ²¡æåå°åèå¢å äºï¼ä»èæé«äºç»è£
æåçï¼è½ç¶å® çåèå¢å ï¼ä½BGAè½ç¨å¯æ§å¡é·è¯çæ³çæ¥ï¼ä»èå¯ä»¥æ¹åå®ççµçæ§è½ï¼å度åééé½è¾ä»¥åçå°è£
ææ¯ææåå°ï¼å¯çåæ°åå°ï¼ä¿¡å·ä¼ è¾å»¶è¿å°ï¼ä½¿ç¨é¢ç大大æé«ï¼ç»è£
å¯ç¨å
±é¢çæ¥ï¼å¯é æ§é«ã BGAå°è£
ææ¯å¯è¯¦å为äºå¤§ç±»ï¼ 1.PBGAï¼Plasric BGAï¼åºæ¿ï¼ä¸è¬ä¸º2-4å±ææºææææçå¤å±æ¿ãIntelç³»åCPUä¸ï¼Pentium IIãIIIãIVå¤çå¨åéç¨è¿ç§å°è£
å½¢å¼ã 2.CBGAï¼CeramicBGAï¼åºæ¿ï¼å³é¶ç·åºæ¿ï¼è¯çä¸åºæ¿é´ççµæ°è¿æ¥é常éç¨åè£
è¯çï¼FlipChipï¼ç®ç§°FCï¼çå®è£
æ¹å¼ãIntelç³»åCPUä¸ï¼Pentium IãIIãPentium Proå¤çå¨åéç¨è¿è¿ç§å°è£
å½¢å¼ã 3.FCBGAï¼FilpChipBGAï¼åºæ¿ï¼ç¡¬è´¨å¤å±åºæ¿ã 4.TBGAï¼TapeBGAï¼åºæ¿ï¼åºæ¿ä¸ºå¸¦ç¶è½¯è´¨ç1-2å±PCBçµè·¯æ¿ã 5.CDPBGAï¼Carity Down PBGAï¼åºæ¿ï¼æå°è£
ä¸å¤®ææ¹åä½é·çè¯çåºï¼å称空è
åºï¼ã 说å°BGAå°è£
å°±ä¸è½ä¸æKingmaxå
¬å¸çä¸å©TinyBGAææ¯ï¼TinyBGAè±æå
¨ç§°ä¸ºTiny Ball Grid Arrayï¼å°åçæ
éµåå°è£
ï¼ï¼å±äºæ¯BGAå°è£
ææ¯çä¸ä¸ªåæ¯ãæ¯Kingmaxå
¬å¸äº1998å¹´8æå¼åæåçï¼å
¶è¯çé¢ç§¯ä¸å°è£
é¢ç§¯ä¹æ¯ä¸å°äº1:1.14ï¼å¯ä»¥ä½¿å
åå¨ä½ç§¯ä¸åçæ
åµä¸å
å容éæé«2ï½3åï¼ä¸TSOPå°è£
产åç¸æ¯ï¼å
¶å
·ææ´å°çä½ç§¯ãæ´å¥½çæ£çæ§è½åçµæ§è½ã 说å°BGAå°è£
å°±ä¸è½ä¸æKingmaxå
¬å¸çä¸å©TinyBGAææ¯ï¼TinyBGAè±æå
¨ç§°ä¸ºTiny Ball Grid Arrayï¼å°åçæ
éµåå°è£
ï¼ï¼å±äºæ¯BGAå°è£
ææ¯çä¸ä¸ªåæ¯ãæ¯Kingmaxå
¬å¸äº1998å¹´8æå¼åæåçï¼å
¶è¯çé¢ç§¯ä¸å°è£
é¢ç§¯ä¹æ¯ä¸å°äº1:1.14ï¼å¯ä»¥ä½¿å
åå¨ä½ç§¯ä¸åçæ
åµä¸å
å容éæé«2ï½3åï¼ä¸TSOPå°è£
产åç¸æ¯ï¼å
¶å
·ææ´å°çä½ç§¯ãæ´å¥½çæ£çæ§è½åçµæ§è½ã BGAçå
¨ç§°æ¯Ball Grid Arrayï¼çæ
éµåç»æçPCBï¼ï¼å®æ¯éæçµè·¯éç¨ææºè½½æ¿çä¸ç§å°è£
æ³ãå®å
·æï¼â å°è£
é¢ç§¯åå°â¡åè½å 大ï¼å¼èæ°ç®å¢å¤â¢PCBæ¿æº¶çæ¶è½èªæå±
ä¸ï¼æä¸é¡â£å¯é æ§é«â¤çµæ§è½å¥½ï¼æ´ä½ææ¬ä½çç¹ç¹ãæBGAçPCBæ¿ä¸è¬å°åè¾å¤ï¼å¤§å¤æ°å®¢æ·BGAä¸è¿å设计为æååç´å¾8~12milï¼BGAå¤è¡¨é¢è´´å°åçè·ç¦»ä»¥è§æ ¼ä¸º31.5mil为ä¾ï¼ä¸è¬ä¸å°äº10.5milãBGAä¸è¿åéå¡åï¼BGAççä¸å
许ä¸æ²¹å¢¨ï¼BGAççä¸ä¸é»å BGA主è¦æåç§åºæ¬ç±»åï¼PBGAãCBGAãCCGAåTBGAï¼ä¸è¬é½æ¯å¨å°è£
ä½çåºé¨è¿æ¥çä½ä¸ºI/Oå¼åºç«¯çççéµåãè¿äºå°è£
çççéµåå
¸åçé´è·ä¸º1.0mmã1.27mmã1.5mmï¼çççé
é¡ç»ä»½å¸¸è§ç主è¦æ63Sn/37Pbå90Pb/10Sn两ç§ï¼çççç´å¾ç±äºç®å没æè¿æ¹é¢ç¸åºçæ åèå个å
¬å¸ä¸å°½ç¸åãä»BGAçç»è£
ææ¯æ¹é¢æ¥çï¼BGAæçæ¯QFPå¨ä»¶æ´ä¼è¶çç¹ç¹ï¼å
¶ä¸»è¦ä½ç°å¨BGAå¨ä»¶å¯¹äºè´´è£
精度çè¦æ±ä¸å¤ªä¸¥æ ¼ï¼ç论ä¸è®²ï¼å¨çæ¥åæµè¿ç¨ä¸ï¼å³ä½¿ççç¸å¯¹äºçççå移éè¾¾50%ä¹å¤ï¼ä¹ä¼ç±äºçæç表é¢å¼ åä½ç¨è使å¨ä»¶ä½ç½®å¾ä»¥èªå¨æ ¡æ£ï¼è¿ç§æ
åµç»å®éªè¯ææ¯ç¸å½ææ¾çãå
¶æ¬¡ï¼BGAä¸ååå¨ç±»ä¼¼QFPä¹ç±»å¨ä»¶çå¼èåå½¢é®é¢ï¼èä¸BGAè¿å
·æç¸å¯¹QFPçå¨ä»¶è¾è¯å¥½çå
±é¢æ§ï¼å
¶å¼åºç«¯é´è·ä¸QFPç¸æ¯è¦å¤§å¾å¤ï¼å¯ä»¥ææ¾åå°å çèå°å·ç¼ºé·å¯¼è´çç¹âæ¡¥æ¥âçé®é¢ï¼å¦å¤ï¼BGAè¿æè¯å¥½ççµæ§è½åçç¹æ§ï¼ä»¥åè¾é«çäºèå¯åº¦ãBGAç主è¦ç¼ºç¹å¨äºçç¹çæ£æµåè¿ä¿®é½æ¯è¾å°é¾ï¼å¯¹çç¹çå¯é æ§è¦æ±æ¯è¾ä¸¥æ ¼ï¼ä½¿å¾BGAå¨ä»¶å¨å¾å¤é¢åçåºç¨ä¸åå°éå¶ã 以ä¸å°±åç§åºæ¬ç±»åçBGAï¼ä»å
¶ç»æç¹ç¹çå¤æ¹é¢å 以éè¿°ã 1.1 PBGA(Plastic Ball Grid Arrayå¡å°çæ
éµå) PBGAå³é常æ说çOMPAC(Overmolded Plastic Array Carrier)ï¼æ¯ææ®éçBGAå°è£
ç±»å(è§å¾2)ãPBGAçè½½ä½æ¯æ®éçå°å¶æ¿åºæï¼ä¾å¦FRï¼4ãBTæ èçãç¡
çéè¿éå±ä¸åçæ¹å¼è¿æ¥å°è½½ä½çä¸è¡¨é¢ï¼ç¶åç¨å¡æ模åæå½¢ï¼å¨è½½ä½çä¸è¡¨é¢è¿æ¥æå
±æ¶ç»ä»½(37Pb/63Sn)çççéµåãççéµåå¨å¨ä»¶åºé¢ä¸å¯ä»¥åå®å
¨åå¸æé¨ååå¸(è§å¾3)ï¼é常ççç尺寸0.75ï½0.89mmå·¦å³ï¼ççèè·æ1.0mmã1.27mmã1.5mmå ç§ã å¾2 PBGAå
é¨ç»æ å¾3é¨ååå¸ä¸å®å
¨åå¸ç¤ºæå¾ PBGAå¯ä»¥ç¨ç°æç表é¢å®è£
设å¤åå·¥èºè¿è¡ç»è£
ãé¦å
éè¿æ¼å°æ¹å¼æå
±æ¶ç»ä»½çèå°å·å°ç¸åºçPCBççä¸ï¼ç¶åæPBGAççç对åºåå
¥çè并è¿è¡åæµï¼å æ¼å°éç¨ççèåå°è£
ä½çççå为å
±æ¶çæï¼æ以å¨åæµè¿ç¨ä¸ççåçèå
±çï¼ç±äºå¨ä»¶ééå表é¢å¼ åçä½ç¨ï¼ççåå¡ä½¿å¾å¨ä»¶åºé¨åPCBä¹é´çé´éåå°ï¼çç¹åºåååæ¤çå½¢ãç®åï¼PBGA169ï½313å·²ææ¹éç产ï¼å大å
¬å¸æ£ä¸æå¼åæ´é«çI/Oæ°çPBGA产åï¼é¢è®¡å¨è¿ä¸¤å¹´å
I/Oæ°å¯è¾¾600ï½1000ã PBGAå°è£
ç主è¦ä¼ç¹ï¼ â å¯ä»¥å©ç¨ç°æçç»è£
ææ¯ååææå¶é PBGAï¼æ´ä¸ªå°è£
çè´¹ç¨ç¸å¯¹è¾ä½ã â¡åQFPå¨ä»¶ç¸æ¯ï¼ä¸æåå°æºæ¢°æ伤ã â¢å¯éç¨äºå¤§æ¹éççµåç»è£
ã PBGAææ¯ç主è¦æææ¯ä¿è¯å°è£
çå
±é¢æ§ãåå°æ½®æ°çå¸æ¶åé²æ¢âpopcornâç°è±¡ç产ç以å解å³å æ¥è¶å¢å¤§çç¡
ç尺寸å¼èµ·çå¯é æ§é®é¢ï¼å¯¹äºæ´é«I/Oæ°çå°è£
ï¼PBGAææ¯çé¾åº¦å°æ´å¤§ãç±äºè½½ä½æç¨æææ¯å°å¶æ¿åºæï¼æ以å¨ç»è£
件ä¸PCBåPBGAè½½ä½ççè¨èç³»æ°(TCE)è¿ä¹ç¸åï¼å æ¤å¨åæµçæ¥è¿ç¨ä¸ï¼å¯¹çç¹å ä¹ä¸äº§çåºåï¼å¯¹çç¹çå¯é æ§å½±åä¹è¾å°ãç®åPBGAåºç¨éå°çé®é¢æ¯å¦ä½ç»§ç»åå°PBGAå°è£
çè´¹ç¨ï¼ä½¿PBGAè½å¨I/Oæ°è¾ä½çæ
åµä¸ä»æ¯QFPèçè´¹ç¨ã 1.2 CBGA(Ceramic Ball Grid Arrayé¶ç·çæ
éµå) å¾4 CBGAåCCGAçç»ææ¯è¾ CBGAé常ä¹ç§°ä½SBC(Solder Ball Carrier)ï¼æ¯BGAå°è£
ç第äºç§ç±»å(è§å¾4)ãCBGAçç¡
çè¿æ¥å¨å¤å±é¶ç·è½½ä½çä¸è¡¨é¢ï¼ç¡
çä¸å¤å±é¶ç·è½½ä½çè¿æ¥å¯ä»¥æ两ç§å½¢å¼ï¼ç¬¬ä¸ç§æ¯ç¡
ç线路å±æä¸ï¼éç¨éå±ä¸åççæ¹å¼å®ç°è¿æ¥ï¼å¦ä¸ç§åæ¯ç¡
çç线路å±æä¸ï¼éç¨åè£
çç»ææ¹å¼å®ç°ç¡
çä¸è½½ä½çè¿æ¥ãç¡
çè¿æ¥å®æä¹åï¼å¯¹ç¡
çéç¨ç¯æ°§æ èçå¡«å
ç©è¿è¡å
å°ä»¥æé«å¯é æ§åæä¾å¿
è¦çæºæ¢°é²æ¤ãå¨é¶ç·è½½ä½çä¸è¡¨é¢ï¼è¿æ¥æ90Pb/10Snççéµåï¼ççéµåçåå¸å¯ä»¥æå®å
¨åå¸æé¨ååå¸ä¸¤ç§å½¢å¼ï¼çç尺寸é常约0.89mmå·¦å³ï¼é´è·å å家å
¬å¸èå¼ï¼å¸¸è§ç为1.0mmå1.27mmã PBGAå¨ä»¶ä¹å¯ä»¥ç¨ç°æçç»è£
设å¤åå·¥èºè¿è¡ç»è£
ï¼ä½ç±äºä¸PBGAçççç»ä»½ä¸åï¼ä½¿å¾æ´ä¸ªç»è£
è¿ç¨åPBGAææä¸åãPBGAç»è£
éç¨çå
±æ¶çèçåæµæ¸©åº¦ä¸º183âï¼èCBGAççççå温度约为300âï¼ç°æç表é¢å®è£
åæµè¿ç¨å¤§é½æ¯å¨220âåæµï¼å¨è¿ä¸ªåæµæ¸©åº¦ä¸ä»
çåäºçèï¼ä½çç没æçåãå æ¤ï¼è¦å½¢æè¯å¥½ççç¹ï¼æ¼å°å°ççä¸ççèéåPBGAç¸æ¯è¦å¤ï¼å
¶ç®çé¦å
æ¯è¦ç¨çèè¡¥å¿CBGAçççå
±å¹³é¢è¯¯å·®ï¼å
¶æ¬¡æ¯ä¿è¯è½å½¢æå¯é ççç¹è¿æ¥ã å¨åæµä¹åï¼å
±æ¶çæå
容ççå½¢æçç¹ï¼ççèµ·å°äºåæ§æ¯æçä½ç¨ï¼å æ¤å¨ä»¶åºé¨ä¸PCBçé´éé常è¦æ¯PBGA大ãCBGAççç¹æ¯ç±ä¸¤ç§ä¸åçPb/Snç»ä»½çæå½¢æçï¼ä½å
±æ¶çæåççä¹é´ççé¢å®é
ä¸å¹¶ä¸ææ¾ï¼é常çç¹çéç¸åæï¼å¯ä»¥çå°å¨çé¢åºåå½¢æä¸ä¸ªä»90Pb/10Snå°37Pb/63Snçè¿æ¸¡åºã ç®åä¸äºäº§åå·²éç¨äºI/Oæ°196ï½625çCBGAå°è£
å¨ä»¶ï¼ä½CBGAçåºç¨è¿ä¸å¤ªå¹¿æ³ï¼æ´é«I/Oæ°çCBGAå°è£
çåå±ä¹åæ»ä¸åï¼ä¸»è¦å½åäºCBGAç»è£
ä¸åå¨çPCBåå¤å±é¶ç·è½½ä½ä¹é´ççè¨èç³»æ°(TCE)ä¸å¹é
é®é¢ï¼è¿ä¸ªé®é¢çåºç°ï¼ä½¿å¾å¨ç循ç¯æ¶å¼èµ·å°è£
ä½å°ºå¯¸è¾å¤§çCBGAçç¹äº§ç失æãéè¿å¤§éçå¯é æ§æµè¯ï¼å·²ç»è¯å®äºå°è£
ä½å°ºå¯¸å°äº32mmÃ32mmçCBGAåå¯ä»¥æ»¡è¶³å·¥ä¸æ åç循ç¯è¯éªè§èãCBGAçI/Oæ°ç®åéå¶å¨625以ä¸ï¼å¯¹äºé¶ç·å°è£
ä½å°ºå¯¸å¨32mmÃ32mm以ä¸çï¼åå¿
é¡»è¦èèéåå
¶å®ç±»åçBGAã CBGAå°è£
ç主è¦ä¼ç¹å¨äºï¼ 1)å
·æä¼è¯ççµæ§è½åçç¹æ§ã 2)å
·æè¯å¥½çå¯å°æ§è½ã 3)åQFPå¨ä»¶ç¸æ¯ï¼CBGAä¸æåå°æºæ¢°æ伤ã 4)éç¨äºI/Oæ°å¤§äº250ççµåç»è£
åºç¨ã æ¤å¤ï¼ç±äºCBGAçç¡
çä¸å¤å±é¶ç·çè¿æ¥å¯ä»¥éç¨åè£
çè¿æ¥æ¹å¼ï¼æ以å¯ä»¥è¾¾å°æ¯éå±ä¸åçè¿æ¥æ¹å¼æ´é«çäºèå¯åº¦ãå¨å¾å¤æ
åµä¸ï¼å°¤å
¶æ¯å¨é«I/Oæ°çåºç¨ä¸ï¼ASICsçç¡
ç尺寸åå°éå±ä¸åççç尺寸çéå¶ï¼CBGAéè¿éç¨äºæ´é«å¯åº¦çç¡
çäºè线路ï¼ä½¿å¾ç¡
çç尺寸å¯ä»¥è¿ä¸æ¥åå°èåä¸çºç²åè½ï¼ä»èéä½äºè´¹ç¨ã ç®åCBGAææ¯çåå±æ²¡æ太大çå°é¾ï¼å
¶ä¸»è¦çææå¨äºå¦ä½ä½¿CBGAå¨çµåç»è£
è¡ä¸çå个é¢åä¸å¾å°å¹¿æ³åºç¨ãé¦å
å¿
é¡»è¦è½ä¿è¯CBGAå°è£
å¨å¤§æ¹éç产工ä¸ç¯å¢ä¸çå¯é æ§ï¼å
¶æ¬¡CBGAå°è£
çè´¹ç¨å¿
é¡»è¦è½åå
¶å®BGAå°è£
ç¸æ¯æãç±äºCBGAå°è£
çå¤ææ§ä»¥åç¸å¯¹é«çè´¹ç¨ï¼ä½¿å¾CBGA被å±éåºç¨äºé«æ§è½ãé«I/Oæ°è¦æ±ççµå产åãæ¤å¤ï¼ç±äºCBGAå°è£
çééè¦æ¯å
¶å®ç±»åBGAå°è£
大ï¼æ以å¨ä¾¿æºå¼çµå产åä¸çåºç¨ä¹åå°éå¶ã 1.3 CCGA(Ceramic Cloumn Grid Array é¶ç·æ±æ
éµå) CCGAä¹ç§°SCC(Solder Column Carrier)ï¼æ¯CBGAå¨é¶ç·ä½å°ºå¯¸å¤§äº32mmÃ32mmæ¶çå¦ä¸ç§å½¢å¼(è§å¾5)ï¼åCBGAä¸åçæ¯å¨é¶ç·è½½ä½çä¸è¡¨é¢è¿æ¥çä¸æ¯ççèæ¯90Pb/10Snççææ±ï¼çææ±éµåå¯ä»¥æ¯å®å
¨åå¸æé¨ååå¸çï¼å¸¸è§ççææ±ç´å¾çº¦0.5mmï¼é«åº¦çº¦ä¸º2.21mmï¼æ±éµåé´è·å
¸åç为1.27mmãCCGAæ两ç§å½¢å¼ï¼ä¸ç§æ¯çææ±ä¸é¶ç·åºé¨éç¨å
±æ¶çæè¿æ¥ï¼å¦ä¸ç§åéç¨æµé¸å¼åºå®ç»æãCCGAççææ±å¯ä»¥æ¿åå PCBåé¶ç·è½½ä½ççè¨èç³»æ°TCEä¸å¹é
产ççåºåï¼å¤§éçå¯é æ§è¯éªè¯å®å°è£
ä½å°ºå¯¸å°äº44mmÃ44mmçCCGAåå¯ä»¥æ»¡è¶³å·¥ä¸æ åç循ç¯è¯éªè§èãCCGAçä¼ç¼ºç¹åCBGAé常ç¸ä¼¼ï¼å¯ä¸çææ¾å·®å¼æ¯CCGAççææ±æ¯CBGAçççå¨ç»è£
è¿ç¨ä¸æ´å®¹æåå°æºæ¢°æ伤ãç®åæäºçµå产åå·²ç»å¼å§åºç¨CCGAå°è£
ï¼ä½æ¯I/Oæ°å¨626ï½1225ä¹é´çCCGAå°è£
ææ¶å°æªå½¢ææ¹éç产ï¼I/Oæ°å¤§äº2000çCCGAå°è£
ä»å¨å¼åä¸ã å¾5 CCGA(Ceramic Cloumn Grid Array é¶ç·æ±æ
éµå) 1.4 TBGA(Tape Ball Grid Array 载带çæ
éµå) å¾6 TBGAå
é¨ç»æ TBGAå称为ATAB(Araay Tape Automated Bonding)ï¼æ¯BGAçä¸ç§ç¸å¯¹è¾æ°çå°è£
ç±»å(è§å¾6)ãTBGAçè½½ä½æ¯é/èé
°äºèº/éåéå±å±å¸¦ï¼è½½ä½çä¸è¡¨é¢åå¸æä¿¡å·ä¼ è¾ç¨çé导线ï¼èå¦ä¸é¢åä½ä¸ºå°å±ä½¿ç¨ãç¡
çä¸è½½ä½ä¹é´çè¿æ¥å¯ä»¥éç¨åè£
çææ¯æ¥å®ç°ï¼å½ç¡
çä¸è½½ä½çè¿æ¥å®æåï¼å¯¹ç¡
çè¿è¡å
å°ä»¥é²æ¢åå°æºæ¢°æ伤ãè½½ä½ä¸çè¿åèµ·å°äºè¿é两个表é¢ãå®ç°ä¿¡å·ä¼ è¾çä½ç¨ï¼ççéè¿éç¨ç±»ä¼¼éå±ä¸åççå¾®çæ¥å·¥èºè¿æ¥å°è¿åççä¸å½¢æççéµåãå¨è½½ä½ç顶é¢ç¨è¶è¿æ¥çä¸ä¸ªå åºå±ï¼ç¨äºç»å°è£
ä½æä¾åæ§åä¿è¯å°è£
ä½çå
±é¢æ§ãå¨åè£
ç¡
ççèé¢ä¸è¬ç¨å¯¼çè¶è¿æ¥çæ£ççï¼ç»å°è£
ä½æä¾è¯å¥½ççç¹æ§ãTBGAçççç»ä»½ä¸º90Pb/10Snï¼ççç´å¾çº¦ä¸º0.65mmï¼å
¸åçççéµåé´è·æ1.0mmã1.27mmã1.5mmå ç§ï¼TBGAä¸PCBä¹é´çç»è£
æéç¨ç为63Sn/37Pbå
±æ¶çæãTBGAä¹å¯ä»¥å©ç¨ç°æç表é¢å®è£
设å¤åå·¥èºï¼éç¨ä¸CBGAç¸ä¼¼çç»è£
æ¹æ³è¿è¡ç»è£
ã ç®å常ç¨çTBGAå°è£
çI/Oæ°å°äº448ï¼TBGA736ç产åå·²ä¸å¸ï¼å½å¤ä¸äºå¤§å
¬å¸æ£å¨å¼åI/Oæ°å¤§äº1000çTBGAã TBGAå°è£
çä¼ç¹å¨äºï¼ â æ¯å
¶å®å¤§å¤æ°BGAå°è£
ç±»åæ´è½»æ´å°(å°¤å
¶æ¯I/Oæ°è¾é«çå°è£
)ã â¡å
·ææ¯QFPåPBGAå°è£
æ´ä¼è¶ççµæ§è½ã â¢å¯éäºæ¹éçµåç»è£
ã æ¤å¤ï¼è¿ç§å°è£
éç¨é«å¯åº¦çåè£
çå½¢å¼å®ç°ç¡
çä¸è½½ä½çè¿æ¥ï¼ä½¿TBGAå
·æä¿¡å·åªå£°å°çå¾å¤ä¼ç¹ï¼ç±äºå°å¶æ¿åTBGAå°è£
ä¸å åºå±ççè¨èç³»æ°TCEåºæ¬ä¸æ¯ç¸äºå¹é
çï¼æ以对ç»è£
åTBGAçç¹å¯é æ§çå½±å并ä¸å¤§ï¼TBGAå°è£
éå°çæ主è¦é®é¢æ¯æ½®æ°çå¸æ¶å¯¹å°è£
çå½±åã TBGAåºç¨éå°çé®é¢æ¯å¦ä½æè½å¨çµåç»è£
é¢åä¸å æä¸å¸ä¹å°ï¼é¦å
TBGAçå¯é æ§å¿
é¡»è½å¨æ¹éç产ç¯å¢ä¸äºä»¥è¯å®ï¼å
¶æ¬¡TBGAå°è£
çè´¹ç¨å¿
é¡»è¦è½åPBGAå°è£
ç¸æ¯æãç±äºTBGAçå¤ææ§åç¸å¯¹é«çå°è£
è´¹ç¨ï¼TBGAç®å主è¦ç¨äºé«æ§è½ãé«I/Oæ°ççµå产åã 2 Flip Chip : åå
¶å®è¡¨é¢å®è£
å¨ä»¶ä¸åï¼åè£
çæ å°è£
ï¼äºèéµååå¸äºç¡
çç表é¢ï¼å代äºéå±ä¸åçè¿æ¥å½¢å¼ï¼ç¡
çç´æ¥ä»¥åæ£æ¹å¼å®è£
å°PCBä¸ãåè£
çä¸åéè¦ä»ç¡
çååå¨å¼åºI/O端ï¼äºèçé¿åº¦å¤§å¤§ç¼©çï¼åå°äºRC延è¿ï¼ææå°æé«äºçµæ§è½ãåè£
çè¿æ¥æä¸ç§ä¸»è¦ç±»åï¼C4ãDC4åFCAAã 2.1 C4(Controlled Collapse Chip Connectionå¯æ§åå¡è¯çè¿æ¥) å¾7 C4ç»æå½¢å¼ C4æ¯ç±»ä¼¼è¶
ç»é´è·BGAçä¸ç§å½¢å¼(è§å¾7)ãä¸ç¡
çè¿æ¥çççéµåä¸è¬çé´è·ä¸º0.203ï½0.254mmï¼ççç´å¾ä¸º0.102ï½0.127mmï¼ççç»ä»½ä¸º97Pb/3Snï¼è¿äºççå¨ç¡
çä¸å¯ä»¥åå®å
¨åå¸æé¨ååå¸ãç±äºé¶ç·å¯ä»¥æ¿åè¾é«çåæµæ¸©åº¦ï¼å æ¤é¶ç·è¢«ç¨æ¥ä½ä¸ºC4è¿æ¥çåºæï¼é常æ¯å¨é¶ç·ç表é¢ä¸é¢å
åå¸æéAuæSnçè¿æ¥çï¼ç¶åè¿è¡C4å½¢å¼çåè£
çè¿æ¥ã C4è¿æ¥ä¸è½ä½¿ç¨ç®åç°æçç»è£
设å¤åå·¥èºè¿è¡ç»è£
ï¼å 为97Pb/3Snççççå温度æ¯320âï¼ä¸å¨è¿ç§éç¨C4è¿æ¥çäºèç»æä¸ä¸åå¨å
¶å®ç»ä»½ççæãå¨C4è¿æ¥ä¸ï¼å代äºçèæ¼å°ï¼èæ¯éç¨å°å·é«æ¸©å©çåçæ¹å¼ï¼é¦å
å°é«æ¸©å©çåå°å·å°åºæçççæç¡
ççççä¸ï¼ç¶åç¡
çä¸çççååºæä¸ç¸åºçç精确对ä½ï¼éè¿å©çåæä¾è¶³å¤çç²éåæ¥ä¿æç¸å¯¹ä½ç½®å¹¶ç´å°åæµçæ¥å®æãC4è¿æ¥éç¨çåæµæ¸©åº¦ä¸º360âï¼å¨è¯¥æ¸©åº¦ä¸çççåï¼ç¡
çå¤äºâæ¬æµ®âç¶æï¼ç±äºçæ表é¢å¼ åçä½ç¨ï¼ç¡
çä¼èªå¨æ ¡æ£ççåçççç¸å¯¹ä½ç½®ï¼æç»çæåå¡è³ä¸å®çé«åº¦å½¢æè¿æ¥ç¹ãC4è¿æ¥æ¹å¼ä¸»è¦åºç¨äºCBGAåCCGAå°è£
ä¸ï¼æ¤å¤ï¼æäºå家å¨é¶ç·å¤è¯ç模å(MCMâC)åºç¨ä¸ä¹ä½¿ç¨è¿ç§ææ¯ãç®åéç¨C4è¿æ¥çI/Oæ°å¨1500以ä¸ï¼ä¸äºå
¬å¸é¢æå¼åçI/Oæ°å°è¶
è¿3000ã C4è¿æ¥çä¼ç¹å¨äºï¼ 1)å
·æä¼è¯ççµæ§è½åçç¹æ§ã 2)å¨ä¸çççé´è·çæ
åµä¸ï¼I/Oæ°å¯ä»¥å¾é«ã 3)ä¸åçç尺寸çéå¶ã 4)å¯ä»¥éäºæ¹éç产ã 5)å¯å¤§å¤§åå°å°ºå¯¸åééã æ¤å¤ï¼C4è¿æ¥å¨ç¡
çååºæä¹é´åªæä¸ä¸ªäºèçé¢ï¼å¯æä¾æççãå¹²æ°æå°çä¿¡å·ä¼ éééï¼åå°ççé¢æ°é使å¾ç»ææ´ç®åï¼å¹¶ä¸å¯é æ§æ´é«ãC4è¿æ¥å¨ææ¯ä¸è¿åå¨å¾å¤ææï¼çæ£åºç¨äºçµå产åè¿æä¸å®çé¾åº¦ãC4è¿æ¥æ¹å¼åªè½éç¨äºé¶ç·åºæï¼å®ä»¬å°å¨é«æ§è½ãé«I/Oæ°ç产åä¸å¾å°å¹¿æ³çåºç¨ï¼ä¾å¦CBGAãCCGAåMCMâCçã 2.2 DCA(Direct Chip Attach ç´æ¥è¯çè¿æ¥) DCAåC4类似ï¼æ¯ä¸ç§è¶
ç»é´è·è¿æ¥(è§å¾8)ãDCAçç¡
çåC4è¿æ¥ä¸çç¡
çç»æç¸åï¼ä¸¤è
ä¹é´çå¯ä¸åºå«å¨äºåºæçéæ©ï¼DCAéç¨çåºææ¯å
¸åçå°å¶ææãDCAçççç»ä»½æ¯97Pb/3Snï¼è¿æ¥çæ¥çä¸ççææ¯å
±æ¶çæ(37Pb/63Sn)ã对äºDCAï¼ç±äºé´è·ä»
为0.203ï½0.254mmï¼å
±æ¶çææ¼å°å°è¿æ¥ççä¸ç¸å½å°é¾ï¼æ以å代çèæ¼å°è¿ç§æ¹å¼ï¼å¨ç»è£
åç»è¿æ¥çç顶éä¸é
é¡çæï¼ççä¸ççæä½ç§¯è¦æ±ååä¸¥æ ¼ï¼é常è¦æ¯å
¶å®è¶
ç»é´è·å
件æç¨ççæå¤ãå¨è¿æ¥ççä¸0.051ï½0.102mmåççæç±äºæ¯é¢éçï¼ä¸è¬ç¥åå顶ç¶ï¼å¿
é¡»è¦å¨è´´çåæ´å¹³ï¼å¦åä¼å½±åççåçççå¯é 对ä½ã å¾8 DCAç»æå½¢å¼ è¿ç§è¿æ¥æ¹å¼å¯ä»¥ç¨ç°å¨ç表é¢å®è£
设å¤åå·¥èºå®ç°ãé¦å
ï¼å©çåéè¿å°å·æ¹å¼è¢«åé
å°ç¡
çä¸ï¼ç¶åè¿è¡ç¡
ççè´´è£
ï¼æååæµçæ¥ãDCAç»è£
éç¨çåæµæ¸©åº¦çº¦220âï¼ä½äºççççç¹ä½é«äºè¿æ¥ççä¸çå
±æ¶çæçç¹ï¼ç¡
çä¸çççä½ç¨ç¸å½äºåæ§æ¯æï¼åæµä¹åå
±æ¶çæçåï¼å¨ççä¸ççä¹é´å½¢æçç¹è¿æ¥ã对äºè¿ç§éç¨ä¸¤ç§ä¸åçPb/Snç»ä»½å½¢æççç¹ï¼å¨çç¹ä¸ä¸¤ç§çæççé¢å®é
并ä¸ææ¾ï¼èæ¯å½¢æä»97Pb/3Snå°37Pb/63Snçå
æ»è¿æ¸¡åºåãç±äºçççåæ§æ¯æä½ç¨ï¼DCAç»è£
ä¸ççä¸âåå¡âï¼ä½è¿å
·æèªæ ¡æ£ç¹æ§ãDCAå·²ç»å¼å§å¾å°åºç¨ï¼I/Oæ°ä¸»è¦å¨350以ä¸ï¼ä¸äºå
¬å¸è®¡åå¼åçI/Oæ°è¶
è¿500ãè¿ç§ææ¯åå±çå¨åä¸æ¯æ´é«çI/Oæ°ï¼è主è¦æ¯çç¼äºå°ºå¯¸ãééåè´¹ç¨çåå°ãDCAçç¹ç¹åC4é常ç¸ä¼¼ï¼ç±äºDCAå¯ä»¥å©ç¨ç°æç表é¢å®è£
å·¥èºå®ç°ä¸PCBçè¿æ¥ï¼æ以è½éç¨è¿ç§ææ¯çåºç¨å¾å¤ï¼å°¤å
¶æ¯å¨ä¾¿æºå¼çµå产åä¸çåºç¨ã ç¶è并ä¸è½å¤¸å¤§DCAææ¯çä¼ç¹ï¼å¨DCAææ¯çåå±è¿ç¨ä¸ä»æ许å¤ææ¯ææãå¨å®é
ç产ä¸ä½¿ç¨è¿ç§ææ¯çç»è£
å家为æ°å¹¶ä¸å¤ï¼ä»ä»¬é½å¨åªåæé«å·¥èºæ°´å¹³ï¼ä»¥æ©å¤§DCAçåºç¨ãç±äºDCAè¿æ¥æé£äºåé«å¯åº¦ç¸å
³çå¤ææ§è½¬ç§»å°PCBä¸ï¼æ以ç»PCBçå¶é å¢å äºé¾åº¦ï¼æ¤å¤ï¼ä¸é¨ç产带æçççç¡
ççå家为æ°ä¸å¤ï¼å¨ç»è£
设å¤ãå·¥èºçåæ¹é¢ä»åå¨çå¾å¤å¼å¾å
³æ³¨çé®é¢ï¼åªæè¿äºé®é¢å¾å°äºè§£å³ï¼æè½æ¨å¨DCAææ¯çåå±ã 2.3 FCAA(Flip Chip Adhesive Attachment åè£
çè¶è¿æ¥) FCAAè¿æ¥åå¨å¤ç§å½¢å¼ï¼å½åä»å¤äºåæå¼åé¶æ®µãç¡
çä¸åºæä¹é´çè¿æ¥ä¸éç¨çæï¼èæ¯ç¨è¶æ¥ä»£æ¿ãè¿ç§è¿æ¥ä¸çç¡
çåºé¨å¯ä»¥æççï¼ä¹å¯ä»¥éç¨çæå¸ç¹çç»æãFCAAæç¨çè¶å
æ¬åååæ§åååå¼æ§çå¤ç§ç±»åï¼ä¸»è¦åå³äºå®é
åºç¨ä¸çè¿æ¥ç¶åµãå¦å¤ï¼åºæçéç¨é常æé¶ç·ãå°å¶æ¿ææåææ§çµè·¯æ¿çãè¿ç§ææ¯ç®åå°æªæçï¼å¨è¿éå°±ä¸ä½æ´å¤çéè¿°ã
ããç¼è¾æ¬æ®µBGAè¿ä¿®å°
ããBGAçå
¨ç§°æ¯Ball Grid Arrayï¼çæ
éµåç»æçPCBï¼ï¼å®æ¯éæçµè·¯éç¨ææºè½½æ¿çä¸ç§å°è£
æ³ãå®å
·æï¼â å°è£
é¢ç§¯åå°â¡åè½å 大ï¼å¼èæ°ç®å¢å¤â¢PCBæ¿æº¶çæ¶è½èªæå±
ä¸ï¼æä¸é¡â£å¯é æ§é«â¤çµæ§è½å¥½ï¼æ´ä½ææ¬ä½çç¹ç¹ãæBGAçPCBæ¿ä¸è¬å°åè¾å¤ï¼å¤§å¤æ°å®¢æ·BGAä¸è¿å设计为æååç´å¾8~12milï¼BGAå¤è¡¨é¢è´´å°åçè·ç¦»ä»¥è§æ ¼ä¸º31.5mil为ä¾ï¼ä¸è¬ä¸å°äº10.5milãBGAä¸è¿åéå¡åï¼BGAççä¸å
许ä¸æ²¹å¢¨ï¼BGAççä¸ä¸é»åã- S% X. i: E% h5 O% X* o" ?# _æ们å
¬å¸ç®å对BGAä¸è¿åå¡å主è¦éç¨å·¥èºæï¼â é²å¹³åå¡åï¼éç¨äºBGAå¡åå¤é»çåé¢é²åºæé¨åé²åºï¼è¥ä¸¤ç§å¡ååå¾ç¸å·®1.5mmæ¶ï¼åæ 论æ¯å¦é»ç两é¢è¦çåéç¨æ¤å·¥èºï¼â¡é»çå¡åï¼åºç¨äºBGAå¡åå¤é»ç两é¢è¦ççæ¿ï¼â¢æ´å¹³ååçå¡åï¼ç¨äºåéç®æ¿æå
¶ä»ç¹æ®éè¦çæ¿ãæå¡é»å尺寸æï¼0.25ã0.30ã0.35ã0.40ã0.45ã0.50ã0.55mmå
±7ç§ã# T4 Z* |" c4 Rå¨CAMå¶ä½ä¸BGAåºåææ ·å¤çå¢ï¼' e+ d; L5 [4 h( Z, O# _3 j# Fä¸ãå¤å±çº¿è·¯BGAå¤çå¶ä½ï¼- Z4 Q8 p, g6 P6 ~: F1 p" X% a( cå¨å®¢æ·èµææªä½å¤çåï¼å
对å
¶è¿è¡å
¨é¢äºè§£ï¼BGAçè§æ ¼ã客æ·è®¾è®¡ççç大å°ãéµåæ
åµãBGAä¸è¿åç大å°ãåå°BGAçççè·ç¦»ï¼éåè¦æ±ä¸º1~1.5çå¸çPCBæ¿ï¼é¤äºç¹å®å®¢æ·çå¶ä½æå
¶éªæ¶è¦æ±åç¸åºè¡¥å¿å¤ï¼å
¶ä½å®¢æ·è¥ç产ä¸éç¨æ©åèå»å·¥èºæ¶ä¸è¬è¡¥å¿2milï¼éç¨å¾çµå·¥èºåè¡¥å¿2.5milï¼è§æ ¼ä¸º31.5mil BGAçä¸éç¨å¾çµå·¥èºå å·¥ï¼å½å®¢æ·æ设计BGAå°è¿åè·ç¦»å°äº8.5milï¼èBGAä¸è¿ååä¸å±
ä¸æ¶ï¼å¯éç¨ä»¥ä¸æ¹æ³ï¼( i* H! i. o/ Q7 Må¯åç
§BGAè§æ ¼ã设计çç大å°å¯¹åºå®¢æ·æ设计BGAä½ç½®åä¸ä¸ªæ åBGAéµåï¼å以å
¶ä¸ºåºåå°éæ ¡æ£çBGAåBGAä¸è¿åè¿è¡ææ£ï¼æè¿ä¹åè¦ä¸åæªæåå¤ä»½çå±æ¬¡å¯¹æ¯æ£æ¥ä¸ä¸ææ£ååçææï¼å¦æBGAççåååå·®è¾å¤§ï¼åä¸å¯éç¨ï¼åªæBGAä¸è¿åçä½ç½®ã! W, {+ f/ x2 GäºãBGAé»çå¶ä½ï¼ 8 A) ^/ ?% b. D7 T: c1ãBGA表é¢è´´é»çå¼çªï¼ä¸é»çä¼åå¼ä¸æ ·å
¶åè¾¹å¼çªèå´ä¸º1.25~3milï¼é»çè·çº¿æ¡ï¼æè¿åççï¼é´è·å¤§äºçäº1.5milï¼ ( p/ s: ^5 @, Z' z2ãBGAå¡å模æ¿å±åå«æ¿å±çå¤çï¼! A" N( l% Q& V2 F$ y. Q4 Lâ å¶å2MMå±ï¼ä»¥çº¿è·¯å±BGAççæ·è´åºä¸ºå¦ä¸å±2MMå±å¹¶å°å
¶å¤ç为2MMèå´çæ¹å½¢ä½ï¼2MMä¸é´ä¸å¯æ空ç½ã缺å£ï¼å¦æ客æ·è¦æ±ä»¥BGAå¤å符æ¡ä¸ºå¡åèå´ï¼å以BGAå¤å符æ¡ä¸º2MMèå´ååæ ·å¤çï¼ï¼å好2MMå®ä½åè¦ä¸å符å±BGAå¤å符æ¡å¯¹æ¯ä¸ä¸ï¼äºè
åè¾å¤§è
为2MMå±ã) T$ f4 e- X; U% l0 Qâ¡å¡åå±ï¼JOB.bgaï¼ï¼ä»¥åå±ç¢°2MMå±ï¼ç¨é¢æ¿ä¸Actionsà reference selectionåè½åè2MMå±è¿è¡éæ©ï¼ï¼åæ°ModeéTouchï¼å°BGA 2MMèå´å
éå¡çåæ·è´å°å¡åå±ï¼å¹¶å½å为ï¼JOB.bgaï¼æ³¨æï¼å¦å®¢æ·è¦æ±BGAå¤æµè¯åä¸ä½å¡åå¤çï¼åéå°æµè¯åéåºï¼BGAæµè¯åç¹å¾ä¸ºï¼é»ç两é¢å¼æ»¡çªæåé¢å¼çªï¼ã7 c7 z" j" b. e3 Y7 g* e5 ]â¢æ·è´å¡åå±ä¸ºå¦ä¸å«æ¿å±ï¼JOB.sdbï¼ã* A8 _; t2 B- G% R. yâ£æBGAå¡åæ件è°æ´å¡åå±åå¾åå«æ¿å±åå¾ã4 \* e, {1 D! e6 r/ v* [ä¸ãBGA对åºå µåå±ãå符å±å¤çï¼5 j* C% S, w3 }' w gâ éè¦å¡åçå°æ¹ï¼å µåå±ä¸¤é¢åä¸å æ¡ç¹ï¼) p2 m1 t2 x/ U) \* G4 sâ¡å符å±ç¸å¯¹å¡åå¤è¿åå
许ç½æ²¹è¿åã5 K1 {0 M# G5 |7 y* M' y以ä¸æ¥éª¤å®æåï¼BGA CAMçåæ¿å¶ä½å°±å®æäºï¼è¿åªæ¯ç®åBGA CAMçåæ¿å¶ä½æ
åµï¼å
¶å®ç±äºçµåä¿¡æ¯äº§åçæ¥æ°æå¼ï¼PCBè¡ä¸çæ¿çç«äºï¼å
³äºBGAå¡åçå¶ä½è§ç¨æ¯ç»å¸¸å¨æ´æ¢ï¼å¹¶ä¸æææ°ççªç ´ãè¿æ¯æ¬¡ççªç ´ï¼ä½¿äº§ååä¸ä¸ä¸ªå°é¶ï¼æ´éåºå¸åºååçè¦æ±ãæ们æå¾
æ´ä¼è¶çå
³äºBGAå¡åæå
¶å®çå·¥èºåºçã
温馨提示:答案为网友推荐,仅供参考